Die Yield Calculator
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Die yield calculation is crucial for semiconductor manufacturing, as it determines the number of functional chips produced from a wafer. This yield impacts cost, efficiency, and profitability.
Background
In semiconductor fabrication, the die yield is the percentage of usable semiconductor dies from a wafer. It is influenced by factors like die area, wafer size, and defect density.
Calculation Formula
The yield is typically estimated using the Poisson model:
\[ \text{Die Yield} = e^{-\text{Defect Density} \times \text{Die Area}} \]
Where:
- Die Area is in mm².
- Defect Density is usually given in defects per cm², so it needs to be converted to mm².
Example Calculation
For a wafer diameter of 300 mm, a die area of 20 mm², and a defect density of 0.05 defects/cm²:
\[ \text{Die Yield} = e^{-(0.05 / 100) \times 20} \approx 90.5\% \]
Importance
High die yields lead to lower costs per chip and better production efficiency, making this calculation vital for planning and scaling semiconductor manufacturing.