Die Yield Calculator

Die yield calculation is crucial for semiconductor manufacturing, as it determines the number of functional chips produced from a wafer. This yield impacts cost, efficiency, and profitability.

Background

In semiconductor fabrication, the die yield is the percentage of usable semiconductor dies from a wafer. It is influenced by factors like die area, wafer size, and defect density.

Calculation Formula

The yield is typically estimated using the Poisson model:

\[ \text{Die Yield} = e^{-\text{Defect Density} \times \text{Die Area}} \]

Where:

• Die Area is in mm².
• Defect Density is usually given in defects per cm², so it needs to be converted to mm².

Example Calculation

For a wafer diameter of 300 mm, a die area of 20 mm², and a defect density of 0.05 defects/cm²:

\[ \text{Die Yield} = e^{-(0.05 / 100) \times 20} \approx 90.5\% \]

Importance

High die yields lead to lower costs per chip and better production efficiency, making this calculation vital for planning and scaling semiconductor manufacturing.